Copper Foil

All of UACJ Foil’s copper foil is order made. We tailor our products to fit customer needs, including materials, measurements and material properties. Our reliable high-quality, high-grade copper foil is used in a variety of products such as cutting-edge electronics, high-end consumer appliances and luxury foods.

We constantly strive to create next-generation applications for copper foil using innovative ideas and solid R&D.

Picture of Copper Foil

Characteristics

UACJ Foil offers world-quality, wide-sheet copper foil for FPC, batteries, electrical lines and other applications. Find out more about the advantages of UACJ Foil’s rolled copper foil.

  Tough Pitch Copper, Oxygen-free Copper
Refining Softness, hardness
Measurements Thickness: ultra-thin (4 μm and up)/Width: wide-sheet (up to 670 mm)

We can tailor products as follows:

1 Dimensional accuracy Thickness, width
2 Surface quality Smoothness, roughness
3 Shape Flatness
4 Pinholes  
5 Mechanical characteristics Stretchability, flexibility, heat-resistance
6 Delivery turnaround  
7 Small-quantity orders  
8 Various types of processing Lamination, coating, printing, stenciling, etc.

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Applications

  • Electromagnetic wave shielding
  • Printed circuit boards
  • Lithium-ion batteries

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Low-roughness Rolled Copper Foil

Using sophisticated rolling technologies accumulated over many years, UACJ Foil has developed rolled copper foil with minimal surface roughness. We can realize a surface roughness (surface roughness meter) of Rz 0.4 μm, allowing manufacture of fine pattern circuits.

Picture of Low-roughness Rolled Copper Foil

Characteristics

  • Available in surface roughness (surface roughness meter) as fine as Rz 0.4 μm.
  • Suited for fine pattern circuits.
  • Supports high frequencies (GHz), and suited for circuit patterns resistant to skin effect.

Specifications

Materials Tough pitch copper
Thickness 8-35 μm
Width 250-650 mm
Surface processing Generally supplied as simple foil, but surface treatments such as roughening may be available upon request.

Applications

  • Fine pattern/high frequency printed wiring boards, etc.

Characteristics

Mechanical/electrical characteristics (12 μm thickness)

Item Representative Value
Tensile strength normal condition (MPa) 450
Stretchability normal condition (%) 1.4
Electrical conductivity 101

Surface roughness

Sample SRM (Surface Roughness Meter) AFM
Rz Ra Rz Ra
ES foil 0.4 0.05 0.24 0.13
Previous UACJ Foil rolled copper foil 0.7 0.09 0.4 0.31
Electrolytic copper foil M surface 1.5 0.27 1.2 0.26
Electrolytic copper foil S surface 1.8 0.33 1.3 0.27
Measurement conditions Probe tip radius 2 μm Probe tip radius 0.05 μm
Measured length 0.8 mm Measured length 1.0 mm
Feeding speed 0.1 mm/s Feeding speed 0.67 mm/s
Cutoff 0.25 mm Cutoff 0.32 mm

Surface photograph (SEM image)

ES foil Rz 0.4 μm (SRM)
Image of ES foil Rz 0.4 μm (SRM)
Previous UACJ Foil rolled copper foil Rz 0.7 μm (SRM)
Image of Previous UACJ Foil rolled copper foil Rz 0.7 μm (SRM)
Electrolytic copper foil M surface Rz 1.5 μm (SRM)
Image of Example Electrolytic copper foil  M surface Rz 1.5 μm (SRM)
Electrolytic copper foil S surface Rz 1.8 μm (SRM)
Image of Example Electrolytic copper foil  S surface Rz 1.8 μm (SRM)

Surface shape (AFM image)

ES foil Rz 0.24 μm (AFM)
Image of ES foil Rz 0.24 μm (AFM)
Previous UACJ Foil rolled copper foil Rz 0.40 μm (AFM)
Image of Previous UACJ Foil rolled copper foil Rz 0.40μm(AFM)
Electrolytic copper foil M surface Rz 1.2 μm (AFM)
Image of Example Electrolytic copper foil  M surface Rz 1.2μm(AFM)
Electrolytic copper foil S surface Rz 1.3 μm (AFM)
Image of Example Electrolytic copper foil  S surface Rz 1.3μm(AFM)

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Copper alloy foil

UACJ Foil’s copper alloy product exhibits excellent strength, heat-resistance and spring not available from pure copper foils (e.g., tough pitch, oxygen-free and electrolytic).

Picture of Copper alloy foil

Characteristics

  • High strength
  • High heat-resistance (good thermal stability)
  • Springiness
  • Available in wide-sheet

Specifications

Material (component Wt %) Example alloys (other copper alloys are also available)
C14410 (Cu- 0.15Sn)
C18040 (Cu- 0.3Cr- 0.25Sn- 0.2Zn)
Thickness 12-35 μm
Width 250-650 mm
Surface processing Generally supplied as simple foil, but surface treatments such as roughening may be available upon request.

Applications

  • High-performance printed wiring boards, microdensity contact materials, etc.

Characteristics

Mechanical/electrical characteristics (12 μm thickness)

  Rolling Direction C14410 C18040 (Reference)
Tough Pitch Copper
12 μm 18 μm 12 μm 18 μm 12 μm 18 μm
Tensile strength normal condition (MPa) Longwise 529 525 646 658 460 470
Perpendicular 573 545 - 694 480 465
Stretchability normal condition (%) Longwise 2 2.6 2.1 2.9 1.3 2
Perpendicular 2.6 2.5 - 3.6 1.2 1
Tensile strength after annealing (MPa) Longwise 162 201 282 279 175 200
(500ºC) (500ºC) (600ºC) (600ºC) (200ºC) (200ºC)
Perpendicular 170 180 - 270 145 180
(500ºC) (500ºC) (600ºC) (200ºC) (200ºC)
Stretchability normal condition (%) Longwise 10.4 18.5 10.6 19.4 10.7 14.9
(500ºC) (500ºC) (600ºC) (600ºC) (200ºC) (200ºC)
Perpendicular 13.8 17.1 - 21.3 10.3 11.8
(500ºC) (500ºC) (600ºC) (200ºC) (200ºC)
Electrical conductivity (%IACS) - 85 71 100

Values are representative, not specifications.